集成电路测试设备与检测仪器是集成电路产业技术研发及生产中不可缺的核心设备。在我国集成电路发展的这些年中，该领域的发展一直没有得到应有的重视，全行业发展处于摸索阶段，甚至一些领域仍然是空白。随着工艺技术的快速发展，测试设备/检测仪器的总投入规模已经达到整个晶圆制造工厂设备总投资规模的30%以上。随着工艺节点的更新，其技术的需求将面临更大的挑战。本书面向中国集成电路测试与检测产业链的技术创新趋势，在借鉴国际测试技术发展路线图的同时，以国内检测与测试产业链为主要对象，针对性的提出了国内集成电路测试产业链技术创新发展路线。全书共6章，从5个方面分析了国内测试产业实现产业技术链创新和赶超国际产业的主要方向，包括集成电路检测、自动化测试ATE和电力电子测试技术与产品，另外还有测试服务和军民融合技术；对正在不断涌现的新领域进行了简要分析；最后对封装测试的市场格局发展进行总结，推动我们集成电路产业赢得更快更好的发展。

集成电路是信息时代的核心基石，其发展水平已经成为衡量一个国家现代化水平和综合实力的重要因素。当前，随着云计算、大数据、物联网、人工智能、5G 通信、智能制造等新兴技术和领域的出现，市场驱动要素发生重大变化，集成电路产业迎来了新一轮发展高峰。 受益于国家对集成电路产业的大力支持，以及全球集成电路产业向中国加快转移的趋势，中国的集成电路发展迎来了历史性的机遇。国家科技重大专项的确立及《国家集成电路产业发展推进纲要》的实施，极大地带动了中国集成电路产业的技术创新、产业投资与竞争能力的提升，逐步形成良性发展的产业格局。 检测与测试是集成电路设计与制造过程中不可或缺的关键环节，其贯穿芯片制造全过程，包括设计过程中的可靠性分析与验证、制造过程中的工艺品质检测、封装过程中的产品功能与性能测试等。集成电路检测与测试的技术与设备为新材料、新结构和新工艺的研发提供了重要支撑，在提高集成电路行业整体制造水平方面具有重要意义。然而，在中国的集成电路产业链中，检测与测试属于薄弱环节，市场仍由海外制造商绝对主导，全行业发展处于摸索阶段。伴随着后摩尔时代的来临，集成电路整体解决方案日趋复杂，失效故障测试模型不断演化，集成电路检测与测试的重要性日益凸显。 “十九大”明确提出“加快建设制造强国，加快发展先进制造业，推动互联网、大数据、人工智能和实体经济深度融合”，习近平总书记近期多次强调大国重器必须掌握在自己手中。在此背景下，在国家科技部重大专项司的支持下，在集成电路产业技术创新联盟的指导下，集成电路测试仪器与装备产业技术创新联盟牵头，联络发动我国集成电路检测与测试核心力量，自2017 年7 月开始，经过多方努力，组织撰写形成了本书。本书借鉴国际集成电路测试技术的新趋势，面向中国集成电路检测与测试产业链的发展和创新需求，以国内集成电路检测与测试产业发展为主要对象，提出了中国集成电路检测与测试产业链技术创新发展路线，主要内容为集成电路检测与测试需求、技术和产品，力求务实并具有针对性，希望引起读者，特别是集成电路从业人员和学者的重视和思考，对我国集成电路产业健康、良性发展有所推动和裨益。

第一章 集成电路工艺品质控制检测技术与产品.........................................1 一、集成电路产业中的工艺品质控制概况··················································1 （一）集成电路产业链与工艺品质控制检测布局································1 （二）工艺品质控制检测技术和设备发展趋势····································2 （三）工艺品质控制检测设备市场整体情况········································4 二、硅制程（前道）中的关键工艺品质控制检测技术与设备··················4 （一）图形化表面检测技术与设备························································7 （二）无图形表面检测技术与设备······················································20 （三）光刻套刻对准测量技术与设备··················································23 （四）其他分析及检测技术与设备······················································25 （五）前道制程中的工艺品质控制检测的整体发展趋势··················26 三、晶圆级封装（中道）中的关键工艺品质控制检测技术与设备········29 （一）三维表面形貌测量技术与设备··················································30 （二）自动光学检测技术与设备（中道）··········································35 （三）无图形表面检测技术与设备······················································37 （四）中道制程中的工艺品质控制检测的整体发展趋势··················37 四、基板与传统封装测试（后道）中的关键工艺品质控制检测技术 与设备····································································································38 （一）自动光学检测技术与设备（后道）········································· 38 （二）自动X 射线检测技术与设备···················································· 41 （三）后道制程中的工艺品质控制检测的整体发展趋势················· 42 第二章 自动化测试设备技术与产品......................................................... 43 一、芯片/模组测试市场需求及发展趋势·················································· 43 （一）电源管理类芯片的测试需求及趋势········································· 47 （二）CIS 芯片的测试需求及趋势······················································ 47 （三）逻辑/混合信号芯片的测试需求及趋势···································· 49 （四）存储器芯片的测试需求及趋势················································· 52 （五）LCD Driver芯片的测试需求及趋势········································· 54 二、ATE 自动测试机械手的现状及发展方向··········································· 57 三、模拟及电源管理芯片ATE 设备发展现状及趋势······························ 59 四、逻辑/混合信号ATE 测试系统的发展现状及趋势····························· 60 五、存储器ATE 测试系统的发展现状及趋势·········································· 62 六、LCD Driver 测试系统的发展现状及趋势··········································· 63 七、其他定制化专用集成电路测试设备发展的方向及趋势··················· 65 八、SLT 测试技术的特点及行业发展前景··············································· 67 九、指纹芯片/模组的测试发展趋势·························································· 69 十、MEMS芯片的测试发展趋势······························································ 71 十一、与芯片可测性设计结合的ATE 设备一体化方案路线·················· 73 第三章 测试服务...................................................................................... 75 一、测试服务——平台技术······································································· 77 （一）整体技术需求············································································· 77 （二）发展趋势····················································································· 77 （三）重点方向····················································································· 78 二、测试服务——共性技术······································································· 81 （一）整体技术需求············································································· 81 （二）重点方向····················································································· 82 （三）发展趋势····················································································· 84 三、测试服务——产品测试解决方案························································84 （一）先进工艺IP 核测试解决方案····················································85 （二）先进封装测试解决方案······························································87 （三）先进核心产品测试解决方案······················································90 第四章 军用与民用集成电路测试差异性研究与技术发展....................... 102 一、整体技术需求······················································································102 二、发展趋势······························································································103 三、重点方向······························································································105 （一）宽温测试技术············································································105 （二）抗辐照测试技术········································································107 （三）电磁环境效应测试技术····························································110 （四）全参数、全功能测试技术························································113 （五）故障及失效测试技术································································115 （六）老炼试验技术············································································117 （七）可测性设计与验证技术····························································119 第五章 电力电子的测试技术与产品....................................................... 125 一、电力电子产品技术现状······································································125 （一）功率二极管技术发展及产品····················································127 （二）功率MOSFET 技术发展及产品··············································129 （三）IGBT 技术发展及产品·····························································130 二、功率半导体器件测试技术··································································132 （一）功率半导体器件稳态参数测试················································132 （二）动态参数测试············································································134 （三）功率半导体器件UIS 雪崩耐量测试技术································146 （四）功率半导体器件热阻测试技术················································150 三、功率半导体器件测试发展趋势及路线图··········································153 第六章 市场发展格局............................................................................. 155 一、全球封装测试业··················································································156 （一）行业规模····················································································156 （二）产业布局··················································································· 157 （三）重点企业排名··········································································· 157 二、我国封装测试业················································································· 158 （一）行业规模··················································································· 158 （二）产业布局··················································································· 159 （三）重点企业排名··········································································· 159